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Effects of interface roughness on the cohesive strength of self-assembled monolayers

机译:界面粗糙度对自组装单分子膜内聚强度的影响

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摘要

Self-assembled monolayers (SAM) are aggregates of small molecular chains that have the property to form highly ordered assemblies. The presence of terminal groups on the constituent chains makes them excellent contenders of molecular level tailoring. Molecular Dynamics (MD) simulations and experimental observations of spallation have shown that cohesive strength of SAM-enriched molecular interfaces is strongly dependent on the choice of terminal groups. Although the MD results of perfectly ordered atomistic surfaces show the same qualitative trend as the experiments, yet they overpredict the interfacial cohesive strengths by factors of 30–50. Results from AFM studies have revealed that the roughness of these interfaces is the same order (~1 nm) as the range of atomistic interactions. Hence, surface roughness is a key contributor in significantly reducing interfacial cohesive strength in these systems. In this research, a continuum level numerical study is performed to investigate the influence of surface roughness on cohesive strength of the interface between SAM and a thin film of gold. We approximate the film as a deformable continuum interacting with a rough substrate of SAM represented by a harmonic function. Using the cohesive law predicted by MD, quasi-static separation tests are performed to evaluate the effective traction separation characteristics for the rough SAM–gold interface. The analysis is effective in demonstrating that the incorporation of roughness reduces the cohesive strength of the interface by up to 90%. Additionally, it is also observed that the gold film adopts unique separation attributes based on roughness parameters and material properties.
机译:自组装单分子层(SAM)是小分子链的聚集体,具有形成高度有序的组件的特性。组成链上末端基团的存在使它们成为分子水平定制的优秀竞争者。分子动力学(MD)模拟和剥落的实验观察表明,富含SAM的分子界面的内聚强度在很大程度上取决于端基的选择。尽管完全有序的原子表面的MD结果显示出与实验相同的定性趋势,但它们高估了界面粘结强度30–50倍。 AFM研究的结果表明,这些界面的粗糙度与原子相互作用的范围相同(约1 nm)。因此,表面粗糙度是显着降低这些系统中界面粘结强度的关键因素。在这项研究中,进行了连续水平的数值研究,以研究表面粗糙度对SAM和金薄膜之间界面的内聚强度的影响。我们将膜近似为与谐波函数表示的SAM粗糙基底相互作用的可变形连续体。使用MD预测的内聚规律,进行准静态分离测试,以评估SAM-金粗糙界面的有效牵引分离特性。该分析有效地证明了粗糙度的引入使界面的内聚强度降低了多达90%。另外,还观察到,金膜根据粗糙度参数和材料特性采用独特的分离属性。

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